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AWT6301 - LINEAR POWER AMPLIFIER

Description

The AWT6301 meets the increasing demands for higher efficiency and linearity in AMPS/CDMA 1X handsets, while reducing pcb area by 44%.

The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board.

Features

  • • • • • • • • • • InGaP HBT Technology High Efficiency: 53 % AMPS, 39 % CDMA Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode:.

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Datasheet Details

Part number AWT6301
Manufacturer ANADIGICS
File Size 272.54 KB
Description LINEAR POWER AMPLIFIER
Datasheet download datasheet AWT6301 Datasheet

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Full PDF Text Transcription

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Cellular Dual Mode AMPS/CDMA 3.4 V/28 dBm Linear Power Amplifier Module ADVANCED PRODUCT INFORMATION - Rev 0.1 AWT6301 FEATURES • • • • • • • • • InGaP HBT Technology High Efficiency: 53 % AMPS, 39 % CDMA Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode: <1 mA VREF = +2.85 V (+2.7 V Min Over Temp.) Optimized for a 50 W System Low Profile Surface Mount Package: 1.1mm CDMA 1XRTT, 1xEV-DO Compliant Pinout Enables Easy Phone Board Migration From 4mm x 4mm Package APPLICATIONS • • Single Mode CDMA Wireless Handsets Dual Mode AMPS/CDMA Wireless Handsets M9 Package 8 Pin 3mm x 3mm Surface Mount Module art reliability, temperature stability, and ruggedness.
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