ANADIGICS AWT6302R
LINEAR POWER AMPLIFIER
FEATURES
● InGaP HBT Technology● High Efficiency: 39%, VMODE = 0 V 40%, VMODE = +2.85 V (no mode switching)
● Low Quiescent Current: 50 mA
● Low Leakage Current in Shutdown Mode: <1 µA
● VREF = +2.85 V (+2.75 V min over temp)
● Optimized for a 50 Ω System
● Low Profile Miniature Surface Mount Package: 1.1 mm
● CDMA 1XRTT, 1xEV-DO Compliant
● Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
● RoHS-Compliant Package, 250 oC MSL-3 AWT6302R Data Sheet - Rev 2.1 M9 Package 8 Pin 3 mm x 3 mm x 1.1 mm Surface Mount Module
APPLICATIONS
● CDMA/EVDO PCS-band Wireless Handsets and Data Devices PRODUCTDESCRIPTION
The AWT6302R meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with very few layout changes to the phone board. The PA module is optimized for VREF = +2.85 V. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.