AWT6302R Description
The AWT6302R meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with very few layout changes to the phone board. The PA module is optimized for VREF = +2.85.
AWT6302R Key Features
- InGaP HBT Technology
- High Efficiency: 39%, VMODE = 0 V 40%, VMODE = +2.85 V (no mode switching)
- Low Quiescent Current: 50 mA
- Low Leakage Current in Shutdown Mode: <1 µA
- VREF = +2.85 V (+2.75 V min over temp)
- Optimized for a 50 Ω System
- Low Profile Miniature Surface Mount Package: 1.1 mm
- CDMA 1XRTT, 1xEV-DO pliant
- Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
- RoHS-pliant Package, 250 oC MSL-3