AWT6307R Description
The AWT6307R meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with few layout changes while reducing board area requirements by 44 %. The AWT6307R uses ANADIGICS’ exclusive InGaPPlus™ technology, which bines HBT and pHEMT devices on the same die, to enable stateof-the-art...
AWT6307R Key Features
- InGaP HBT Technology High Efficiency: 21 % @ +16 dBm output 40 % @ +28 dBm output