Datasheet4U Logo Datasheet4U.com

AWT6307R - LINEAR POWER AMPLIFIER

Description

The AWT6307R meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets.

The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with few layout changes while reducing board area requirements by 44 %.

Features

  • InGaP HBT Technology High Efficiency: 21 % @ +16 dBm output 40 % @ +28 dBm output.
  • Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode:.

📥 Download Datasheet

Datasheet Details

Part number AWT6307R
Manufacturer ANADIGICS
File Size 208.22 KB
Description LINEAR POWER AMPLIFIER
Datasheet download datasheet AWT6307R Datasheet

📁 Similar Datasheet

  • AWT6102M2 - EGSM/DCS/PCS Triple Band Power Amplifier Module (ANADIGICS Inc)
  • AWT6103M5 - Cellular Dual Mode AMPS/TDMA Mode 3.5V/30 dBm Linear Power Amplifier Module (ANADIGICS Inc)
  • AWT6104M5 - PCS TDMA 3.5V/30 dBm Linear Power Amplifier Module (ANADIGICS Inc)
  • AWT6107 - EGSM/DCS Dual Band 3.5V GPRS Power Amplifier Module (ANADIGICS Inc)
  • AWT6134 - KPCS/CDMA 3.4V/28dBm Linear Power Amplifier Module (ANADIGICS Inc)
  • AWT6134M7P8 - KPCS/CDMA 3.4V/28dBm Linear Power Amplifier Module (ANADIGICS Inc)
  • AWT6146 - QUAD BAND POWER AMPLIFIER MODULE WITH INTERGRATED POWER CONTROL (ANADIGICS Inc)
  • AWT6222 - WCDMA/HSPA Power Amplifiers (Analogic Corporation)
  • AWT1921S11 - Integrated High Power Amp 1610 MHz (ANADIGICS Inc)
  • AWT4502S10 - TX Power MMIC (ANADIGICS Inc)
Other Datasheets by ANADIGICS

Full PDF Text Transcription

Click to expand full text
AWT6307R HELP TM Cellular CDMA 3.4 V/28 dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.0 FEATURES • • InGaP HBT Technology High Efficiency: 21 % @ +16 dBm output 40 % @ +28 dBm output • • • • • • • • Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode: <1 µA Internal Voltage Regulation Optimized for a 50 Ω System Low Profile Surface Mount Package: 1 mm CDMA 1XRTT, 1xEV-DO Compliant Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package RoHS Compliant Package, 250 oC MSL-3 AW T63 07 R APPLICATIONS • CDMA Wireless Handsets and Data Devices M9 Package 8 Pin 3 mm x 3 mm x 1 mm Surface Mount Module PRODUCT DESCRIPTION The AWT6307R meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets.
Published: |