ANADIGICS AWT6307R
LINEAR POWER AMPLIFIER
FEATURES
●● InGaP HBT Technology High Efficiency: 21 % @ +16 dBm output 40 % @ +28 dBm output
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● Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode: <1 µA Internal Voltage Regulation Optimized for a 50 Ω System Low Profile Surface Mount Package: 1 mm CDMA 1XRTT, 1xEV-DO Compliant Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package RoHS Compliant Package, 250 oC MSL-3 AW T63 07 R
APPLICATIONS
● CDMA Wireless Handsets and Data Devices M9 Package 8 Pin 3 mm x 3 mm x 1 mm Surface Mount Module PRODUCTDESCRIPTION
The AWT6307R meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with few layout changes while reducing board area requirements by 44 %. The AWT6307R uses ANADIGICS’ exclusive InGaPPlus™ technology, which combines HBT and pHEMT devices on the same die, to enable stateof-the-art reliability, temperature stability, and ruggedness.