AWT6308R Description
The AWT6308R meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with few layout changes while reducing board area requirements by 44%. The AWT6308R uses ANADIGICS’ exclusive InGaPPlus™ technology, which bines HBT and pHEMT devices on the same die, to enable state-ofthe-art...
AWT6308R Key Features
- Rev 1.0