ANADIGICS AWT6302
LINEAR POWER AMPLIFIER
| Part No. | AWT6302 |
|---|---|
| Datasheet | AWT6302 Download |
| Manufacturer |  ANADIGICS |
| Description | LINEAR POWER AMPLIFIER |
| Buy | Stock & Price |
FEATURES
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● InGaP HBT Technology High Efficiency: 40% Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.8 V (+2.7 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1mm CDMA 1XRTT, 1xEV-DO Compliant Pinout Enables Easy Phone Board Migration From 4mm x 4mm Package
APPLICATIONS
●● PCS CDMA Wireless Handsets Dual Band CDMA Wireless Handsets M9 Package 8 Pin 3mm x 3mm Surface Mount Module PRODUCT
DESCRIPTION
The AWT6302 meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The PA module is optimized for VREF = +2.8 V, a requirement for compatibility with the Qualcomm® 6000 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
