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AWT6302 - LINEAR POWER AMPLIFIER

Description

The AWT6302 meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%.

The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board.

Features

  • InGaP HBT Technology High Efficiency: 40% Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode:.

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Datasheet Details

Part number AWT6302
Manufacturer ANADIGICS
File Size 205.10 KB
Description LINEAR POWER AMPLIFIER
Datasheet download datasheet AWT6302 Datasheet

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Full PDF Text Transcription

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AWT6302 PCS/CDMA 3.4V/28dBm Linear Power Amplifier Module ADVANCED PRODUCT INFORMATION - Rev 0.1 FEATURES • • • • • • • • • InGaP HBT Technology High Efficiency: 40% Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.8 V (+2.7 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1mm CDMA 1XRTT, 1xEV-DO Compliant Pinout Enables Easy Phone Board Migration From 4mm x 4mm Package APPLICATIONS • • PCS CDMA Wireless Handsets Dual Band CDMA Wireless Handsets M9 Package 8 Pin 3mm x 3mm Surface Mount Module PRODUCT DESCRIPTION The AWT6302 meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%.
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