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CPD17. For precise diagrams, and layout, please refer to the original PDF.
PROCESS Ultra Fast Rectifier CPD17 3 Amp Glass Passivated Rectifier Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Sid...
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DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 88 x 88 MILS 14 MILS 69 x 69 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 1,200 PRINCIPAL DEVICE TYPES 1N5802 thru 1N5806 UES1101 thru UES1106 CMR3U-01 Series BACKSIDE CATHODE R4 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CPD17 Typical Electrical Characteristics R4 (22-March 2010) w w w. c e n t r a l s e m i .
CPD17 Datasheet
