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CPD24. For precise diagrams, and layout, please refer to the original PDF.
PROCESS CPD24 Fast Recovery Rectifier 1 Amp Glass Passivated Rectifier Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Si...
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S DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 51 x 51 MILS 11 MILS 35 x 35 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 4,250 PRINCIPAL DEVICE TYPES 1N4933 thru 1N4937 1N4942 thru 1N4948 1N5615 thru 1N5623 CMR1F-02M Series BACKSIDE CATHODE R1 R3 (29-April 2010) w w w. c e n t r a l s e m i . c o m PROCESS CPD24 Typical Electrical Characteristics R3 (29-April 2010) w w w. c e n t r a l s e m i .
CPD24 Datasheet
