Full PDF Text Transcription for CPD66X (Reference)
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CPD66X. For precise diagrams, and layout, please refer to the original PDF.
PROCESS CPD66X Low Leakage Diode Low Leakage Diode Chip www.DataSheet4U.com PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side ...
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Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 17.5 x 17.5 MILS 5.9 MILS 7.9 MILS DIAMETER Al - 30,000Å Au-As - 13,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 54,848 PRINCIPAL DEVICE TYPES CMOD3003 CMLD3003DOG CMPD3003A CMPD3003C CMPD3003S R1 (19-July 2010) w w w. c e n t r a l s e m i . c o m PROCESS CPD66X Typical Electrical Characteristics R1 (19-July 2010) w w w. c e n t r a l s e m i .
CPD66X Datasheet
