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CPD74. For precise diagrams, and layout, please refer to the original PDF.
PROCESS CPD74 Switching Diode Monolithic Isolated Quad Switching Diode Chip www.DataSheet4U.com PROCESS DETAILS Die Size Die Thickness Anode 1, 2, 3, 4 Bonding Pad Area C...
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ESS DETAILS Die Size Die Thickness Anode 1, 2, 3, 4 Bonding Pad Area Cathode 1, 2, 3, 4 Bonding Pad Area Top Side Metalization Back Side Metalization 25 x 25 MILS 6.0 MILS 3.5 x 4.0 MILS 3.5 x 4.0 MILS Al - 12,000Å Au - 5,000Å GEOMETRY GROSS DIE PER 3 INCH WAFER 10,000 PRINCIPAL DEVICE TYPES CMEDA-6i R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CPD74 Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i .
CPD74 Datasheet
