Spec. No. : C891J3
CYStech Electronics Corp.
Issued Date : 2016.12.23
Revised Date :
Absolute Maximum Ratings (TC=25°C, unless otherwise noted)
Continuous Drain Current @ TJ=175°C, TC=25°C, VGS=-10V (Note 1)
Continuous Drain Current @ TJ=175°C,TC=100°C, VGS=-10V (Note 1)
Continuous Drain Current @TA=25°C, VGS=-10V
Continuous Drain Current @TA=70°C, VGS=-10V
Pulsed Drain Current
Avalanche Current @L=0.1mH
Avalanche Energy @ L=2mH, ID=-16A, RG=25Ω
Total Power Dissipation
Operating Junction and Storage Temperature Range
Thermal Resistance, Junction-to-case
Thermal Resistance, Junction-to-ambient, t≤10s (Note 2)
Thermal Resistance, Junction-to-ambient, steady state
Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air
environment with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction
temperature of 150°C. The value in any given application depends on the user’s specific board design.
3. Pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and low duty
cycles to keep initial TJ=25°C.
4. 100% tested by conditions of L=0.1mH, VGS=-10V, IAS=-10A, VDD=-50V
CYStek Product Specification