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DIM200MHS12-A000 - Igbt Modules - Half Bridge

Key Features

  • I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY.

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Datasheet Details

Part number DIM200MHS12-A000
Manufacturer Dynex Semiconductor
File Size 204.91 KB
Description Igbt Modules - Half Bridge
Datasheet download datasheet DIM200MHS12-A000 Datasheet

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www.DataSheet4U.com DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Replaces June 2002, version DS5535-2.1 DS5535-3.0 March 2003 FEATURES I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES (typ) VCE(sat)* (max) IC (max) IC(PK) 1200V 2.2V 200A 400A *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS I I Inverters Motor Controllers 11(C2) 2(E2) 6(G2) 7(E2) 3(C1) 1(E1C2) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A. The DIM200MHS12-A000 is a half bridge switch 1200V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module.