The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
www.DataSheet4U.com
DIM200PHM33-F000
DIM200PHM33-F000
Half Bridge IGBT Module
Preliminary Information
DS5606-1.2 June 2003
FEATURES
I I I I
KEY PARAMETERS VCES VCE(sat) * IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A
Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability
* Measured at auxiliary terminals.
APPLICATIONS
I I I
1(E1/C2) 2(C1) 5(E1) 4(G1) 3(E2) 7(E2) 6(G2)
High Reliability Inverters Motor Controllers Traction Auxiliaries
The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 3600A.
DIM200PHM33-F000 Datasheet
