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WS512K32V - 512K x 32 SRAM 3.3V MODULE

Description

I/O0-31 A0-18 WE1-4 CS1-4 I/O29 I/O28 A0 A1 A2 WE1 CS 1 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected OE VCC GND NC BLOCK DIAGRAM WE2 CS2 WE3 CS 3 WE 4CS4 OE A0-18 512K x 8 512K x 8 I/O23 I/O22 512K x 8 512K x 8 I/O21 I/O20 66 I/

Features

  • s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging.
  • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400).
  • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509).

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Datasheet preview – WS512K32V

Datasheet Details

Part number WS512K32V
Manufacturer ETC
File Size 128.03 KB
Description 512K x 32 SRAM 3.3V MODULE
Datasheet download datasheet WS512K32V Datasheet
Additional preview pages of the WS512K32V datasheet.

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Full PDF Text Transcription

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WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE FEATURES s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509) PRELIMINARY* s Low Power CMOS s TTL Compatible Inputs and Outputs s Fully Static Operation: • No clock or refresh required. s Three State Output. s Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation s Weight WS512K32V-XG2TX - 8 grams typical WS512K32V-XG1UX - 5 grams typical WS512K32NV-XH1X - 13 grams typical * This data sheet describes a product under development, not fully characterized, and is subject to change without notice. • 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U), 3.
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