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FDZ293P Datasheet P-Channel 2.5 V Specified PowerTrench BGA MOSFET

Manufacturer: Fairchild (now onsemi)

General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space and rDS(on).

This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low rDS(on).

Overview

FDZ293P P-Channel 2.5 V Specified PowerTrench® BGA MOSFET Feb 2006 FDZ293P P-Channel 2.

Key Features

  • 4.6 A,.
  • 20 V rDS(on) = 46 mΩ @ VGS =.
  • 4.5 V rDS(on) = 72 mΩ @ VGS =.
  • 2.5 V.
  • Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of a SSOT-6.
  • Ultra-thin package: less than 0.85 mm height when mounted to PCB.
  • Outstanding thermal transfer characteristics: 4 times better than SSOT-6.
  • Ultra-low Qg x rDS(on) figure-of-merit.
  • High power and current handling capability. S.