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FDZ294N Datasheet N-Channel 2.5 V Specified PowerTrench BGA MOSFET

Manufacturer: Fairchild (now onsemi)

General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ294N minimizes both PCB space This BGA MOSFET embodies a and RDS(ON).

breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).

Overview

www.DataSheet4U.com FDZ294N July 2005 FDZ294N N-Channel 2.5 V Specified PowerTrench® BGA.

Key Features

  • 6 A, 20 V RDS(ON) = 23 mΩ @ VGS = 4.5 V RDS(ON) = 34 mΩ @ VGS = 2.5 V.
  • Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of a SSOT-6.
  • Ultra-thin package: less than 0.85mm height when mounted to PCB.
  • Outstanding thermal transfer characteristics: 4 times better than SSOT-6.
  • Ultra-low Qg x RDS(ON) figure-of-merit.
  • High power and current handling capability.