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FDZ372NZ Key Features

  • Max rDS(on) = 50 mΩ at VGS = 4.5 V, ID = 2 A
  • Max rDS(on) = 60 mΩ at VGS = 2.5 V, ID = 2 A
  • Max rDS(on) = 72 mΩ at VGS = 1.8 V, ID = 1 A
  • Max rDS(on) = 93 mΩ at VGS = 1.5 V, ID = 1 A
  • Occupies only 1.0 mm2 of PCB area. Less than 30% of the
  • Ultra-thin package: less than 0.4 mm height when mounted to PCB
  • HBM ESD protection level > 3200V (Note3)
  • RoHS pliant

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FDZ372NZ Description

Less than 30% of the area of 2x2 BGA „ Ultra-thin package: less than 0.4 mm height when mounted to PCB „ HBM ESD protection level > 3200V (Note3) „ RoHS pliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ372NZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which...