FDZ391P Description
less than 0.4 mm height when mounted to PCB RoHS pliant tm Designed on Fairchild's advanced 1.5 V PowerTrench process with state of the art "low pitch" Thin WLCSP packaging process, the FDZ391P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, ultra-low profile packaging, low...
FDZ391P Key Features
- Max rDS(on) = 85 mΩ at VGS = -4.5 V, ID = -1 A
- Max rDS(on) = 123 mΩ at VGS = -2.5 V, ID = -1 A
- Max rDS(on) = 200 mΩ at VGS = -1.5 V, ID = -1 A
- Occupies only 1.5 mm2 of PCB area
- Ultra-thin package: less than 0.4 mm height when mounted to PCB
- RoHS pliant