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FDZ372NZ Datasheet N-channel 1.5 V Specified Powertrench Thin Wl-csp MOSFET

Manufacturer: Fairchild (now onsemi)

Overview: FDZ372NZ N-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET March 2010 FDZ372NZ N-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET 20 V, 4.

General Description

„ Max rDS(on) = 50 mΩ at VGS = 4.5 V, ID = 2 A „ Max rDS(on) = 60 mΩ at VGS = 2.5 V, ID = 2 A „ Max rDS(on) = 72 mΩ at VGS = 1.8 V, ID = 1 A „ Max rDS(on) = 93 mΩ at VGS = 1.5 V, ID = 1 A „ Occupies only 1.0 mm2 of PCB area.

Less than 30% of the area of 2x2 BGA „ Ultra-thin package: less than 0.4 mm height when mounted to PCB „ HBM ESD protection level > 3200V (Note3) „ RoHS pliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ372NZ minimizes both PCB space and rDS(on).

This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

Key Features

  • General.

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