FDZ372NZ Description
Less than 30% of the area of 2x2 BGA Ultra-thin package: less than 0.4 mm height when mounted to PCB HBM ESD protection level > 3200V (Note3) RoHS pliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ372NZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which...
FDZ372NZ Key Features
- Max rDS(on) = 50 mΩ at VGS = 4.5 V, ID = 2 A
- Max rDS(on) = 60 mΩ at VGS = 2.5 V, ID = 2 A
- Max rDS(on) = 72 mΩ at VGS = 1.8 V, ID = 1 A
- Max rDS(on) = 93 mΩ at VGS = 1.5 V, ID = 1 A
- Occupies only 1.0 mm2 of PCB area. Less than 30% of the
- Ultra-thin package: less than 0.4 mm height when mounted to PCB
- HBM ESD protection level > 3200V (Note3)
- RoHS pliant