Silicon Chip on Direct-Copper Bond (DCB) Substrate Isolated Mounting Surface 4000V Electrical Isolation High Peak Current Capability Low Saturation Voltage Molding Epoxie.

( Electrically Isolated Tab) IXGF20N300 VCES = IC25 = VCE(sat) ≤ 3000V 22A 3.2V Symbol VCES VCGR VGES VGEM IC25 IC90.

High Voltage IGBT

IXGF20N250

IXGF25N250

IXGF25N300

IXGF30N400

IXGF32N170

IXGF36N300

IXGA10N60

IXGA10N60A

IXGA12N100

IXGA12N100A

IXGA12N100AU1

IXGA12N100U1

IXGA12N120A2

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