GWM100-01X1 Key Features
- MOSFETs in trench technology
- low RDSon
- optimized intrinsic reverse diode
- package
- high level of integration
- high current capability 300 A max
- aux. terminals for MOSFET control
- terminals for soldering or welding connections
- isolated DCB ceramic base plate with optimized heat transfer
- Space and weight savings Package options