IRF6898MTRPbF Datasheet | Infineon

Description The IRF6898MPb F bines the latest HEXFET® Power MOSFET Silicon technology with the advanced Direct FET™ packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The Direct FET™ package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The Direct FET™ package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6894MPb F balances industry leading on-state resistance while minimizing gate charge along with low gate resistance to reduce both conduction and switching losses. This part contains an integrated Schottky diode to reduce the Qrr of the body drain diode further reducing the losses in a Synchronous Buck circuit. The reduced losses make this product ideal for high frequency/high efficiency DC-DC converters that power high current loads such as the latest generation of microprocessors. The IRF6898MPb F has been optimized for parameters that are critical in synchronous buck converter’s Sync FET sockets. Base part number IRF6898MPb F Package Type Direct FET® Medium Can Standard Pack Form Quantity Tape and Reel Orderable Part Number IRF6898MTRPb F Absolute Maximum Ratings Parameter VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC = 25°C IDM EAS Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V (Silicon Limited)- Continuous Drain Current, VGS @ 10V (Silicon Limited)- Continuous Drain Current, VGS @ 10V (Silicon Limited) Pulsed Drain Current Single Pulse Avalanche Energy  Avalanche Current  Max. 25 ±16 40 32 214 320 537 Units V A m J A Typical RDS(on) (m) VGS, Gate-to-Source Voltage (V) 3.0 ID = 40A TJ = 125°C 1.0 TJ = 25°C 0.0 2 4 6 8 10 12 14 16 18 20 VGS, Gate...