01 τJ R1 R1 τJ τ1 τ2 R2 R2 R3 R3 τ3 R4 R4 τC τ τ1 τ2 τ3 τ4 τ4 0.1 Ri (°C/W) 0.678 17.30 17.57 9.470 τi (sec) 0.000860 0.577560 8.940000 106.0000 0.01 0.001 SINGLE P.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6691 combines IR’s industry leading DirectFET package technology with the latest monolithic die technology, which integrates MOSFET plus free-wheeling Schottky diode. The DirectFET package is compatible with existing layout geometries used in .

IRF6691PBF

IRF6691TRPBF

IRF6601

IRF6603

IRF6604

IRF6607

IRF6607TR1

IRF6608

IRF6609

IRF6609PBF

IRF6609TRPBF

IRF6610

IRF6611