Download IRF6706S2TR1PBF Datasheet PDF
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IRF6706S2TR1PBF Key Features

  • RoHS pliant and Halogen Free
  • Low Profile (<0.7 mm)
  • Dual Sided Cooling patible
  • Ultra Low Package Inductance
  • Optimized for High Frequency Switching
  • Ideal for CPU Core DC-DC Converters
  • Optimized for Control FET Application 
  • patible with existing Surface Mount Techniques

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IRF6706S2TR1PBF Description

The IRF6706S2TRPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve improved performance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application...