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IRF6712SPBF Key Features

  • RoHS pliant and Halogen Free 
  • Low Profile (<0.7 mm)
  • Dual Sided Cooling patible 
  • Ultra Low Package Inductance
  • Optimized for High Frequency Switching 
  • Ideal for CPU Core DC-DC Converters DirectFET™ Power MOSFET ‚ Typical values (unless otherwise specified) VD
  • Optimized for both Sync.FET and some Control FET application
  • Low Conduction and Switching Losses

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IRF6712SPBF Description

The IRF6712SPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when...