PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6712SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET pack.

IRF6712SPBF

IRF6710S2

IRF6710S2TR1PbF

IRF6710S2TRPbF

IRF6711SPBF

IRF6711STRPBF

IRF6713SPBF

IRF6713STRPBF

IRF6714MPbF

IRF6714MTRPbF

IRF6715MPbF

IRF6715MTRPbF

IRF6716MPBF