.5V 4.0V 3.5V 3.0V 2.8V 2.5V 100 10 2.5V 1 0.1 1 10 100 VDS, Drain-to-Source Voltage (V) 10 0.1 1 2.5V 10 100 V DS, Drain-to-Source Voltage (V) Fig 4. Typical Outpu.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6716MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package.

IRF6716MPBF

IRF6710S2

IRF6710S2TR1PbF

IRF6710S2TRPbF

IRF6711SPBF

IRF6711STRPBF

IRF6712SPBF

IRF6712STRPBF

IRF6713SPBF

IRF6713STRPBF

IRF6714MPbF

IRF6714MTRPbF

IRF6715MPbF