The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
MOSFET, N-Channel, POWERTRENCH)
Q1: 30 V, 66 A, 4 mW Q2: 30 V, 42 A, 5.5 mW
FDMD8900
General Description This devices utilizes two optimized N−ch FETs in a dual 3.3 x 5 mm
thermally enhanced power package. The HS Source and LS drain are internally connected providing a low source inductance package, helping to provide the best FOM.
Features
Q1: N−Channel
• Max rDS(on) = 4 mW at VGS = 10 V, ID = 19 A • Max rDS(on) = 5 mW at VGS = 4.5 V, ID = 17 A • Max rDS(on) = 6.5 mW at VGS = 3.8 V, ID = 15 A • Max rDS(on) = 8.3 mW at VGS = 3.5 V, ID = 14 A
Q2: N−Channel
• Max rDS(on) = 5.5 mW at VGS = 10 V, ID = 17 A • Max rDS(on) = 6.5 mW at VGS = 4.5 V, ID = 15 A • Max rDS(on) = 9 mW at VGS = 3.8 V, ID = 13 A • Max rDS(on) = 12 mW at VGS = 3.