K1S3216B1C Description
The K1S3216B1C is fabricated by SAMSUNG′s advanced CMOS technology using one transistor memory cell. The device supports Industrial temperature range and 48 ball Chip Scale Package for user flexibility of system design. The device also supports dual chip selection for user interface.
K1S3216B1C Key Features
- Package Type: 48-FBGA-6.0x8.0
- 2Revision 0.1 June 2003