SSG4841P Datasheet | SeCoS Halbleitertechnologie GmbH

Elektronische Bauelemente -9.0 A, -40 V, RDS(ON) 35 m P-Ch Enhancement Mode Power MOSFET Ro HS pliant Product A suffix of “-C” specifies halogen & lead-free DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management In portable and battery-powered products such as puters, printers, PCMCIA cards, cellular and cordless telephones. SOP-8 Features - A - - - Low RDS(on) provides higher efficiency and extends battery life. Low thermal impedance copper leadframe SOIC-8 saves board space. Fast switching speed. High performance trench technology. REF. A B C D E F G PACKAGE INFORMATION Package SOP-8 MPQ 2.5K Leader Size 13’ inch Millimeter Min. Max. 5.80 6.20 4.80 5.00 3.80 4.00 0° 8° 0.40 0.90 0.19 0.25 1.27 TYP. REF. H J K L M N Millimeter Min. Max. 0.35 0.49 0.375 REF. 45° 1.35 1.75 0.10 0.25 0.25 REF. MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 1 Pulsed Drain Current 2 Continuous Source Current (Diode Conduction) Total Power Dissipation 1 Operating Junction & Storage Temperature Range t≦10 sec Steady State Symbol VDS VGS ID @ TA = 25°C ID @ TA = 70°C IDM IS PD @ TA = 25°C PD @ TA = 70°C TJ, TSTG Thermal Resistance Ratings Ratings -40 ±20 -9.0 -7.3 ±50 -2.1 3.1 2.6 -55 ~ 150 50 92 Unit V V A A A A W W °C °C / W °C / W Thermal Resistance Junction-ambient (Max.) 1 RθJA Notes: 1. Surface Mounted on 1” x 1” FR4 Board. 2. Pulse width limited by maximum junction temperature. http://.Se Co SGmb H./ Any changes of specification will not be informed individually. 31-Dec-2010 Rev. B Page 1 of 2 Free Datasheet http://../ Elektronische Bauelemente -9.0 A, -40 V, RDS(ON) 35 m P-Ch Enhancement Mode Power...