• Part: TDG650E60
  • Description: Bottom- or Top-side Cooled 650V E-mode GaN FET
  • Manufacturer: Teledyne Technologies
  • Size: 2.66 MB
Download TDG650E60 Datasheet PDF
Teledyne Technologies
TDG650E60
TDG650E60 is Bottom- or Top-side Cooled 650V E-mode GaN FET manufactured by Teledyne Technologies.
TDG650E60 Bottom- or Top-side Cooled 650 V E-mode GaN FET Product Specification April 2020 Features - 650 V enhancement mode power switch with P-GaN gate structure - Bottom- or Top-side cooled configuration - RDS(on) = 25 mΩ (typ) - IDS(max) = 60 A - Ultra-low FOM Island Technology® die - Ultra-low inductance GaNPX® package - Easy gate drive requirements (0 V to 6 V) with 7V tolerance - Transient tolerant gate drive (-20 / +10 V) 1μs - Very high switching frequency (> 10 MHz) - Reverse current capability - Zero reverse recovery loss - Small 11 x 9 mm2 PCB footprint - Source Sense (SS) pads for optimized gate drive - Dual gate and source sense pads for optimal board layout - RoHS...