CPD73 Datasheet (Central Semiconductor) - Bridge Rectifier Monolithic Quad Diode Bridge

CPD73, Bridge Rectifier Monolithic Quad Diode Bridge

PROCESS CPD73 Bridge Rectifier Monolithic Quad Diode Bridge Chip www.DataSheet4U.com PROCESS DETAILS Die Size Die Thickness Bonding Pad Area 1 (+DC) Bonding Pad Area 2 (AC) Bonding Pad Area 3 (-DC) Bonding Pad Area 4 (AC) Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 3 INCH WAFER 10,000 PRINCIPAL DEVICE TYPES CMFBR-6F 25 x 25 MILS 6.0 MILS 3.0 x 3.0 MILS 3.0 x 7.0 MILS 3.0 x 4.0 MILS 3.0 x 7.0 MILS Al - 12,000Å Au - 5,000Å R2 (22-March 2010) w w w.

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