CPD79 Datasheet - centralsemi

CPD79 2 Amp Schottky Rectifier

PROCESS Schottky Rectifier CPD79 2 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 49 x 49 MILS 9.8 MILS 39 x 39 MILS Al/Ni/Au - 30,000Å/3,000Å/1,500Å Ti/Ni/Au - 1,600Å/5,500Å/1,600Å GEOMETRY GROSS DIE PER 4 INCH WAFER 4,608 PRINCIPAL DEVICE TYPE CTLSH2-40M832 R0 (19-July 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD79 Typical Electrical Characteristics R0 (19-Jul.

CPD79-centralsemi.pdf