Part number:
CPQ165
Manufacturer:
File Size:
65.30 KB
Description:
Triac.
PROCESS
www.DataSheet4U.com
CPQ165
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bondi.
CPQ165
65.30 KB
Triac.
PROCESS
www.DataSheet4U.com
CPQ165
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bondi.
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