Part number:
CPQ166
Manufacturer:
centralsemi
File Size:
184.39 KB
Description:
Triac.
PROCESS CPQ166
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M.
CPQ166
centralsemi
184.39 KB
Triac.
PROCESS CPQ166
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M.
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