* 2 mm2 Footprint
* 67% smaller than PowerDI123
* Off Board Profile of 0.3mm
* 70% thinner than PowerDI123
* Low Forward Voltage Drop reduces Power Dissipation
* Soft switching characteristic ensures that EMI and EFI are minimised
* Guard Ring Die Construction for
SDM1L30CSP Datasheet (313.86 KB)
SDM1L30CSP
313.86 KB
1a schottky barrier diode chip scale package.
NEW PNREOWDUPCRTODUCT
SDM1L30CSP
1A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
Product Summary
VRRM (V) 30
IO (A) 1.0
VF(MAX) (V) @ +25°C
0.40
IR.
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