GP200MHS12 Datasheet, Module, Dynex Semiconductor

GP200MHS12 Features

• Module s s s Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1200V 2.7V 200A 400A APPLICAT

PDF File Details

Part number:

GP200MHS12

Manufacturer:

Dynex Semiconductor

File Size:

99.55kb

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📄 Datasheet

Description:

Half bridge igbt module.

GP200MHS12 Application

• Applications s s s s High Power Inverters Motor Controllers Induction Heating Resonant Converters 11(C2) 1(E1C2) 2(E2) 6(G2) 7(E2) 3(C1) 5(E1) 4(G1

TAGS

GP200MHS12

Dynex Semiconductor

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