Part number:
GP200MHS12
Manufacturer:
Dynex Semiconductor
File Size:
99.55 KB
Description:
Half bridge igbt module.
GP200MHS12_DynexSemiconductor.pdf
Datasheet Details
GP200MHS12 Features
* s s s Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1200V 2.7V 200A 400A APPLICATIONS s s s s High Power Inverters Motor Controllers Induction Heating Resonant Converters 11(C2) 1(E1C2) 2(E2) 6(G
GP200MHS12_DynexSemiconductor.pdf
Datasheet Details
GP200MHS12
Dynex Semiconductor
99.55 KB
Half bridge igbt module.
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