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HB56A132BW - High Density Dynamic RAM Module

This page provides the datasheet information for the HB56A132BW, a member of the HB56A132 High Density Dynamic RAM Module family.

Description

The HB56A132 is a 1 M × 32 dynamic RAM module, mounted 8 pieces of (4-Mbit) DRAM (HM514400CS/CLS) sealed in SOJ package.

An outline of the HB56A132 is 72-pin single in-line package.

Therefore, the HB56A132 makes high density mounting possible without surface mount technology.

Features

  • 72-pin single in-line package.
  • Lead pitch: 1.27 mm.
  • Single 5 V (± 5%) supply.
  • High speed.
  • Access time: 60 ns/70 ns/80 ns (max).
  • Low power dissipation.
  • Active mode: 4.62W/4.20W/3.78W (max).
  • Standby mode: 84 mW (max) 4.2 mW (max) (L-version).
  • Fast page mode capability.
  • 1,024 refresh cycle: 16 ms 128 ms (L-version).
  • 2 variations of refresh.
  • RAS only refresh.
  • CAS before RAS refresh.

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Datasheet preview – HB56A132BW

Datasheet Details

Part number HB56A132BW
Manufacturer Hitachi Semiconductor
File Size 80.46 KB
Description High Density Dynamic RAM Module
Datasheet download datasheet HB56A132BW Datasheet
Additional preview pages of the HB56A132BW datasheet.

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Full PDF Text Transcription

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HB56A132 Series 1,048,576-word × 32-Bit High Density Dynamic RAM Module ADE-203Rev. 0.0 Dec. 1, 1995 Description The HB56A132 is a 1 M × 32 dynamic RAM module, mounted 8 pieces of (4-Mbit) DRAM (HM514400CS/CLS) sealed in SOJ package. An outline of the HB56A132 is 72-pin single in-line package. Therefore, the HB56A132 makes high density mounting possible without surface mount technology. The HB56A132 provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ. Features • 72-pin single in-line package — Lead pitch: 1.27 mm • Single 5 V (± 5%) supply • High speed — Access time: 60 ns/70 ns/80 ns (max) • Low power dissipation — Active mode: 4.62W/4.20W/3.78W (max) — Standby mode: 84 mW (max) 4.
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