* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.
HYE18L128160BC-75 Datasheet (569.46 KB)
HYE18L128160BC-75
569.46 KB
Drams for mobile applications.
Infineon Specialty DRAMs
Mobile-RAM
w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M
Never stop thinking.
Mobile-RAM
* Ext.
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