HYE18L128160BC-75 Datasheet, Applications, Infineon

HYE18L128160BC-75 Features

• Applications M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for sm

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HYE18L128160BC-75

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📄 Datasheet

Description:

Drams for mobile applications.

HYE18L128160BC-75 Application

• Applications I N F I N E O N ’ S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions and system design)
  

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HYE18L128160BC-75

Infineon

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