Datasheet Specifications
- Part number
- HYE18L128160BC-75
- Manufacturer
- Infineon ↗
- File Size
- 569.46 KB
- Datasheet
- HYE18L128160BC-75_InfineonTechnologiesAG.pdf
- Description
- DRAMs for Mobile Applications
Description
Infineon Specialty DRAMs Mobile-RAM w w w.i n f i n e o n .c o m / m e m o r y / Mo b i l e - R A M Never stop thinking.Mobile-RAM * Ext.
Features
* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.Applications
* I N F I N E O N ’ S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions and system design)HYE18L128160BC-75 Distributors
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