IDT72V263 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO

Integrated Device Tech

Description

3.3 VOLT HIGH-DENSITY SUPERSYNC II™ NARROW BUS FIFO 512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9 2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9 8,192 x 18/16,.
The IDT72V223/72V233/72V243/72V253/72V263/72V273/72V283/ 72V293 are exceptionally deep, high speed, CMOS First-In-First-Out (FIFO) memories with cloc.

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Datasheet Specifications

Part number: IDT72V263
Manufacturer: Integrated Device Tech
File Size: 264.49 KB
Datasheet: IDT72V263_IntegratedDeviceTechnology.pdf
Description: 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO

Features

* Choose among the following memory organizations: IDT72V223  512 x 18/1,024 x 9 IDT72V233  1,024 x 18/2,048 x 9 IDT72V243  2,048 x 18/4,096 x 9 IDT72V253  4,096 x 18/8,192 x 9 IDT72V263  8,192 x 18/16,384 x 9 IDT

Applications

* that need to buffer large amounts of data and match busses of unequal sizes. PIN CONFIGURATIONS WCLK PRS MRS LD FWFT/SI FF/IR PAF OW FSEL0 HF FSEL1 BE IP VCC PAE PFM EF/OR RM RCLK REN 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 INDEX WEN SEN DNC(1) VCC DNC(1) IW GND D17 VCC D16 D1

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IDT72V263 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO Integrated Device Tech

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