* the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT
* 23 package, PD can be calculated as follows: PD = TJ(max)
* TA RθJA SOLDERING PRECAUTIONS The melting temperature of
BCW61DLT1 Datasheet (394.84 KB)
BCW61DLT1
Motorola Inc
394.84 KB
General purpose transistors.
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BCW61BLT1/D General Purpose Transistors PNP Silicon COLLECTOR 3 1 BASE BCW61BLT1 BCW6.
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