BSP16T1 PNP SILICON HIGH VOLTAGE TRANSISTOR

Motorola Inc

Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BSP16T1/D SOT-223 Package High Voltage Transistor PNP Silicon COLLECTOR 2,4 BASE 1 EMI.

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Datasheet Specifications

Part number: BSP16T1
Manufacturer: Motorola Inc
File Size: 109.16 KB
Datasheet: BSP16T1_MotorolaInc.pdf
Description: PNP SILICON HIGH VOLTAGE TRANSISTOR

Features

* JOINT SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 1. Typical Solder Heating Profile 4 Motorola Small
* Signal Transistors, FETs and Diodes Device Data BSP16T1 PACKAGE DIMENSIONS A F NOTES: 1. DIMENSIONING AND TOLERANCING

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.15 3.8 0.079 2.0 interface between the board and the package. With the correct pad geometry, the packages will self align

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BSP16T1 PNP SILICON HIGH VOLTAGE TRANSISTOR Motorola Inc

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