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BCW61DLT1 General Purpose Transistors

BCW61DLT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BCW61BLT1/D General Purpose Transistors PNP Silicon COLLECTOR 3 1 BASE BCW61BLT1 BCW6.

BCW61DLT1 Features

* the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT
* 23 package, PD can be calculated as follows: PD = TJ(max)
* TA RθJA SOLDERING PRECAUTIONS The melting temperature of

BCW61DLT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
BCW61DLT1
Manufacturer
Motorola Inc
File Size
394.84 KB
Datasheet
BCW61DLT1_MotorolaInc.pdf
Description
General Purpose Transistors

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General Purpose Transistors Motorola Inc
Motorola Inc BCW61DLT1-like datasheet