NTE424 Datasheet - NTE Electronics

NTE424, Non-Silicone Heat Sink Compound

NTE424 Non *Silicone Thermal Compound 1 oz.Plunger Tube .
NTE424 heat sink compound is a grease. like, non. silicone, non. migrating material heavily impregnated with heat. conduc.

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Datasheet Details

Part number:

NTE424

Manufacturer:

NTE Electronics

File Size:

154.20 KB

Description:

Non-Silicone Heat Sink Compound

Features

* D Non
* Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C
* In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL
* C
* 47113 & MIS
* 19846 Specif

Applications

* The NTE424 heat sink compound is applied to the base and mounting studs of transistors, diodes and silicon controlled rectifiers (SCRs). In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods. NTE424 can be used as a high

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NTE424 Non-Silicone Heat Sink Compound NTE Electronics

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