NTE424 Datasheet - NTE Electronics

Non-Silicone Heat Sink Compound

NTE424 Features

* D Non

* Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C

* In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL

* C

* 47113 & MIS

* 19846 Specif

NTE424 General Description

NTE424 heat sink compound is a grease *like, non *silicone, non *migrating material heavily impregnated with heat *conductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability. NTE424 has been engineered to solve .

NTE424 Datasheet (154.20 KB)

NTE424 Datasheet Preview — Preview of NTE424 PDF

Datasheet Details

Part number:

NTE424

Manufacturer:

NTE Electronics

File Size:

154.20 KB

Description:

Non-silicone heat sink compound.

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NTE424 Non-Silicone Heat Sink Compound NTE Electronics

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NTE424 Features

NTE424 General Description

Datasheet Details

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