NTE424 - Non-Silicone Heat Sink Compound

NTE Electronics

NTE424 Datasheet Preview — Preview of NTE424 PDF

Datasheet Details

Part number	NTE424
Manufacturer	NTE Electronics
File Size	154.20 KB
Description	Non-Silicone Heat Sink Compound
Datasheet	NTE424_NTEElectronics.pdf

NTE424 Product details

Description

NTE424 heat sink compound is a grease like, non silicone, non migrating material heavily impregnated with heat conductive metal oxides. based products. based thermal grease use to insure quick, efficient heat transfer and dissi

Features

D Non.
Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C.
In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL.
C.
47113 & MIS.
19846 Specifications D Will Not harden, Dry.
Out or Melt D Will Not Contaminate Solder bath or Other Devices D Non.
Toxic D Reworkable/Easy to Remove D Easy to Dispense Typical Properties: Viscosity.

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Published: May 28, 2007 |