NTE424 Non-Silicone Heat Sink Compound

NTE Electronics

Description

NTE424 Non *Silicone Thermal Compound 1 oz.Plunger Tube .
NTE424 heat sink compound is a grease. like, non. silicone, non. migrating material heavily impregnated with heat. conduc.

📥 Download Datasheet

NTE424 Datasheet Preview — Preview of NTE424 PDF

Datasheet Specifications

Part number: NTE424
Manufacturer: NTE Electronics
File Size: 154.20 KB
Datasheet: NTE424_NTEElectronics.pdf
Description: Non-Silicone Heat Sink Compound

Features

* D Non
* Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C
* In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL
* C
* 47113 & MIS
* 19846 Specif

Applications

* The NTE424 heat sink compound is applied to the base and mounting studs of transistors, diodes and silicon controlled rectifiers (SCRs). In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods. NTE424 can be used as a high

NTE424 Distributors

📁 Related Datasheet

NTE4032B NTE4038B NTE4066B NTE4151P NTE4153N NTE4153NT1G

📌 All Tags

NTE424 Non-Silicone Heat Sink Compound NTE Electronics

NTE Electronics NTE424-like datasheet