Description
Symbol
Ratings
Units
Drain to Source Voltage (Note 1)
Drain to Gate Voltage (RGS = 20 kW) (Note 1) Gate to Source Voltage
Drain Current Continuous (Figure 2) Pulsed Drain Current
Pulsed Avalanche Rating
Power Dissipation Derate Above 25°C
VDSS VDGR VGS
ID IDM EAS PD
100 V 100 V ±20 V
56 Figure 4 Figures 6, 14, 15
200 1.35
V V V
A
W W/°C
Operating and Storage Temperature
TJ, TSTG
55 to 175°C
°C
Maximum Temperature for Soldering
Leads at 0.063in (1.6 mm) from Case for 10s
TL
Features
- 56 A, 100 V.
- Simulation Models.
- Temperature Compensated PSPICE® and SABER™ Electrical Models.
- Spice and Saber Thermal Impedance Models.
- www. onsemi. com.
- Peak Current vs Pulse Width Curve.
- UIS Rating Curve.
- Related Literature.
- TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”.
- These Devices are Pb.
- Free, Halogen Free/BFR Free and are RoHS
Compliant
TO.
- 247.
- 3LD CAS.
