Description
TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer *molded power module with low thermal resistanc.
Features
* Low Thermal Resistance Substrate for Low Thermal Resistance
* Lower Package Height than Standard Case Modules
* 6 mm Clearance distance between pin to heatsink
* Compact 73 mm × 40 mm × 8 mm Package
* Solderable Pins
* Thermistor
* These Devi
Applications
* Industrial Motor Drives
* Servo Drives
DBPLUS P
www. onsemi. com
DIP26 67.8x40 CASE 181AD MARKING DIAGRAM
GUP
GVP
GWP
R
S
B
U
V
W
T
GB
GUN
GVN
GWN
DBMINUS
NB
NU
NV
NW
Figure 1. NXH50C120L2C2ESG Schematic Diagram
DBPLUS P
TH1
TH2
ORDERING INFORMATION
Device