NXH50C120L2C2ES1G Datasheet - ON Semiconductor

NXH50C120L2C2ES1G TMPIM 50A CIB/CI Module

TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer molded power module with low thermal resistance substrate containing a converter-inverter-brake circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A, 1200 V brake IGBT with brake diode and an NTC thermistor. The NXH50C120L2C2ES1G is a transfer molded power module with low thermal resistance substrate containing a converter inve.

NXH50C120L2C2ES1G Features

* Low Thermal Resistance Substrate for Low Thermal Resistance

* Lower Package Height than Standard Case Modules

* 6 mm Clearance distance between pin to heatsink

* Compact 73 mm × 40 mm × 8 mm Package

* Solderable Pins

* Thermistor

* These Devi

NXH50C120L2C2ES1G Datasheet (416.41 KB)