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NXH50C120L2C2ESG TMPIM 50A CIB/CI Module

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Description

TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer *molded power module with low thermal resistanc.

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Features

* Low Thermal Resistance Substrate for Low Thermal Resistance
* Lower Package Height than Standard Case Modules
* 6 mm Clearance distance between pin to heatsink
* Compact 73 mm × 40 mm × 8 mm Package
* Solderable Pins
* Thermistor
* These Devi

Applications

* Industrial Motor Drives
* Servo Drives DBPLUS P www. onsemi. com DIP26 67.8x40 CASE 181AD MARKING DIAGRAM GUP GVP GWP R S B U V W T GB GUN GVN GWN DBMINUS NB NU NV NW Figure 1. NXH50C120L2C2ESG Schematic Diagram DBPLUS P TH1 TH2 ORDERING INFORMATION Device

NXH50C120L2C2ESG Distributors

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📌 All Tags

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