* Low Thermal Resistance Substrate for Low Thermal Resistance
* Lower Package Height than Standard Case Modules
* 6 mm Clearance distance between pin to heatsink
* Compact 73 mm × 40 mm × 8 mm Package
* Solderable Pins
* Thermistor
* These Devi
NXH50C120L2C2ESG Datasheet (416.41 KB)
NXH50C120L2C2ESG
416.41 KB
Tmpim 50a cib/ci module.
TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer molded power module with low thermal resistanc.
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