* f this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 5 STEP 6 STEP 7 STEP 4 HEATING VENT COOLING HEATING ZONES 3 & 6 ZONES 4 & 7 205° TO “SPIKE” “SOAK” 219°C 170°C PEAK AT SOLDER 160°C JOINT SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING
PZT65
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High current npn silicon transistor.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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NPN Silicon Planar Epitaxial Transistor
This NPN Silicon Epitaxial transist.
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