size 1206: 3,2(L) x 1,6(W) x 1,2(H) mm circuit substrate: glass laminated epoxy devices are ROHS conform lead free solderable, soldering pads: gold plated taped in 8 mm blister tape, cathode to transporting perforation - all devices sorted into luminous intensity classes - taping: face-up (TU) or face-down (TD) possible - high luminous intensity types
Absolute Maximum Ratings
IF, max[mA] 20 IF,P [mA] tp ≤ 100 µs τ=1: 10 100 VR [V] 5 IR, max [µA] 100 Thermal resistance R thJA [K / W] 450 TOp [°C.
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