AN80T05 - Silicon Monolithic Bipolar IC
Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi),
Panasonic Semiconductor Singapore Company Registration No.
197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506.
Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 21-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document.
Doc No.
Doc Title SDSC-PSE-AN80T05 Product Specifications for AN80T05 Revision History Total no.
of pages (excluding this page)
