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F1010EL, F1010E Power MOSFET

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Description

PD - 91720 IRF1010ES IRF1010EL l l l l www.DataSheet4U.com l l Advanced Process Technology Surface Mount (IRF1010ES) Low-profile through-hole (IRF10.
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon.

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This datasheet PDF includes multiple part numbers: F1010EL, F1010E. Please refer to the document for exact specifications by model.
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Datasheet Specifications

Part number
F1010EL, F1010E
Manufacturer
Power MOSFET
File Size
161.55 KB
Datasheet
F1010E_PowerMOSFET.pdf
Description
Power MOSFET
Note
This datasheet PDF includes multiple part numbers: F1010EL, F1010E.
Please refer to the document for exact specifications by model.

Features

* rrent Body Diode Forward Current di/dt D. U. T. VDS Waveform Diode Recovery dv/dt [VDD] Re-Applied Voltage Inductor Curent Body Diode Forward Drop Ripple ≤ 5% [ ISD ]
* VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET® power MOSFETs www. irf. com 7 IRF

Applications

* The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection

F1010EL Distributors

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